领导 & O领导高级显示器
密封 & 填实
显示增强
绝缘 & 屏蔽
磁带 & 粘合剂
相机 & 传感器
磁带 & 粘合剂
密封 & 填实
屏蔽 & 绝缘
传导冷却
电池 & 充电系统
磁带 & 粘合剂
密封 & 填实
屏蔽 & 绝缘
传导冷却
High Density Interconnect PCB Assemblies
磁带 & 粘合剂
密封 & 填实
屏蔽 & 绝缘
传导冷却
移动电子产品
Fully Integrated 密封, 保护, and 热 Solutions
Boyd is a world leader in designing and 制造业 fully integrated sealing, 保护, and thermal solutions for mobile electronics to meet ever increasing performance requirements. Our world class expertise, 制造业, and customer support helps reduce design cycle time with rapid prototyping capabilities, assembly time by combining multiple components into a single assembly for final production, and landed costs by decreasing OEM’s managed vendor list.
Smaller, Lighter Consumer Demands
移动 electronics have become a cornerstone of our modern lifestyle with smartphones, 平板电脑, and notebooks in countless offices and homes across the globe. Consumers consistently demand thinner and lighter products that are more powerful and connect faster than ever before.
Challenging User Environments
Consumers use their mobile electronics in nearly every environment, accelerating the need for adequate sealing solutions against liquid immersion and particulates. Consumers expose mobile electronics to an onslaught of environmental hazards 就像 spilled liquids, 灰尘, and dirt as they have become integral in our active lifestyles.
What Goes Into Making Advanced 显示 Solutions
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Precision Converting Solutions
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移动电子产品 密封 Solutions
Boyd broad offering of IP seals, 垫圈, and advanced adhesive assemblies ensure sensitive components 就像 cameras, 传感器, 演讲者, 麦克风, and PCBs stay safe and sealed away from environmental hazards that can hinder reliable performance and the excellent customer experience you want. With advanced rotary converting 制造业 technology in Class 100 cleanrooms, Boyd has pure operational environments to provide particulate-free components for the most sensitive applications with the highest visual and aesthetic demands. Boyd’s sealing innovative solutions enhance operational efficiency with access to creative new 制造业 processes as well as maximize product reliability and customer satisfaction with long term sealing performance.
移动电子产品 热 Solutions
Consumers demand electronics to be fully mobile with more processing power and better performance. Smaller products with higher performance face the challenge of dramatically increasing power density. Excessive heat damages internal components and can cause products to perform poorly, shorten product lifespans, and put consumers at risk for heat-related injuries. To ensure long mobile electronic lifetimes, effective thermal management solutions must dissipate heat efficiently and safely. Dissipating heat more quickly and effectively enables greater power density designs, which either means smaller dimensional footprint of devices or higher-powered internal components resulting in smaller handheld devices.
Boyd’s Ultra-Thin 热 Management Heritage
Boyd has decades of experience designing, 制造业, and testing low profile thermal management solutions that meet or exceed customer requirements. Boyd’s expertise covers both active solutions that include low profile, high performance blowers as well as passive solutions, which are ideal for intense product usage, 就像 ultra-thin copper vapor chambers, 热管, and graphite spreaders.
移动电子产品 保护 Solutions
Most mobile electronics must withstand daily use and wear, which means they require high performance solutions that protect sensitive electronics, 传感器, and screens them from the elements. 移动 electronics suffer from exposure to mechanical 冲击、振动, EMI和RFI, 沙子, 灰尘和污垢, all of which require adequate 保护 to mitigate risk to the operational stability and safety of the device.
Boyd’s 屏蔽 and 绝缘 Solutions
Boyd’s world class precision converting capabilities produce fully integrated 保护 solutions specifically designed for mobile electronic products. Our engineering team can match the right materials, 粘合剂, 几何图形, and production processes to manufacture high quality and cost-effective 保护 assemblies with tight tolerance control in an easy-to-assemble delivery format.
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