Semiconductor
Semiconductor Burn-In and Test Sockets
逻辑和记忆烧入和测试插座具有创新的接触技术，提供更可靠的电气和机械互连. 触点设计经过优化，以尽可能低的致动力将对焊锡球的损害降至最低. Contacts open to allow package insertion for 0.5mm pitch and above. Several contact technologies, both through- hole and compression mount, are used for finer pitch packages < 0.5mm. 平台设计为基础插座提供了最大的灵活性，可以利用为特定客户的包定制的适配器用于不同的包尺寸. 将适配器更改为套接字比为每个包尺寸提供新的套接字更快，成本更低. 修改底座设计使我们能够帮助客户选择最小的插座占用空间，以最大限度地提高烧损板容量和吞吐量.
Lower Total Cost of Ownership
Integrated solutions minimize or remove waste, maintenance costs, and downtime.
Global Resources, Regional Support
Respond quickly to geopolitical changes, strategy shifts in region sourcing, near-shoring or global manufacturing moves with Boyd’s supply chain flexibility and replicated, scalable, global manufacturing.
Accelerate Time to Market
客户至上的服务，市场领先的速度和响应能力，结合数十年的半导体设计专业知识和稳健, 专有的建模工具使Boyd能够快速迭代设计并加快上市速度.
Semiconductor Test Thermal Forcing Systems
无液体热系统利用创新的相变技术，在整个制造周期的多个阶段为半导体测试提供-55°C至250°C的温度强迫范围. Phase change technologies enable quieter, portable test solutions with fast stabilization, superior power handling, and precision control. 易于集成的热强迫系统，占地面积最小，可用于您的测试环境, or into production automated test equipment. Thermal forcing systems accommodate a wide range of device sizes and types, whether socketed or soldered down. Applications include DUT level thermal management, thermal stream replacement, temperature forcing, handler integrations, ATE test, bench testing, system level testing, high reliability testing, and OEM integrations.
ATE Liquid Cooling Systems and Insulation
半导体自动化测试设备(ATE)运行速度快，功率大，要求先进 liquid cooling systems. 博伊德创新的液体冷却系统优化了半导体测试的每一步，以实现最终的质量控制，最大的测试周期效率，可信赖的可靠性和最快的上市速度. 由高效液体冷却系统驱动的液体冷板和无颗粒冷却器, non-toxic SOLIMIDE® Foam 隔热层使流体管道保持低温，因此晶圆片和芯片在纯净环境中的安全温度下进行测试. 优化的热管理和绝缘保护敏感部件免受过度热负荷和污染物的影响，同时减少热循环测试时间.
Decrease Test Times
Boyd’s highly efficient, reliable, and sustainable liquid cooling systems decrease test times, maximize temperature forcing range, or decrease chip operation temperature for faster processing and better uptimes.
Direct to Chip Cooling Systems
全面的直接芯片冷却beat365官方网站大全范围从空气冷却到高效液体冷却和创新的浸入式冷却开发，最大限度地提高热密度，并在最紧凑的格式中实现更高的处理能力. Cool switch chips up to 2200 watts (W), GPUs up to 750W, 和高达6KW的igbt, Boyd的持续研究和开发将功率密度和计算性能界限推向新的水平.
Boyd’s Chip Cooling Technologies
Leveraging high performance fans and blowers with remote heat pipe-heat sink assemblies, 极端空气冷却可以很容易地冷却云应用程序中的整个刀片和机架，同时最大限度地提高服务器密度，并利用现有设施管道在当前基础设施中进行有效的性能升级. Liquid loops and liquid cold plates cooled by coolant distribution units (CDUs) 或其他液体冷却系统为先进的gpu提供最高性能的直接芯片液体冷却, CPUs, and switch chips. 定制的天际线液体冷板在液体系统和处理器之间创造了最有效的热界面, customized to maximize thermal efficiency for each system installation. 这最大限度地提高了系统的整体性能和环境可持续性，同时实现了更高的处理密度和更长的半导体寿命，从而实现了市场上的性能差异化.
Faster Processing Speeds and More Processing Power
Cooler chips mean faster semiconductor processing. With Boyd’s overlapping thermal technology portfolio of liquid, two phase, and air-cooling innovations, we’re able to recommend and blend the right fit for each application.
Increase Power Density and Pack More I/O in Smaller Sizes
利用博伊德的高效液体冷却系统和隔热材料，创造额外的设计空间或更小的半导体beat365官方网站大全，以更小的占地面积实现更高的性能.
Increase Reliability and Quality
将半导体和设备保持在最佳工作温度范围内，以延长使用寿命并提高可靠性.
Advanced Engineered Materials for Semiconductors
复杂的制造和自动化测试设备简化了生产过程中的质量保证，并且需要的精度水平只能通过高性能beat365官方网站大全beat365官方网站大全来实现. Pure, stable, 超净材料有助于保持高质量所需的无污染生产和测试环境, reliable semiconductors. Vibration mitigation, environmental sealing, thermal insulation, electrical isolation, high temperature bonding, FFKM o-rings, and EMI and RF shielding 在制造和测试过程中保护半导体，以确保精度和提高半导体芯片产量.
Related Products & Resources
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